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Shanghai Huitian New Material Co., Ltd
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0113 Thermal Conductive Grease Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal 2.1W/m·K

0113 Thermal Conductive Grease Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal 2.1W/m·K

0113 Thermal Conductive Grease Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal 2.1W/m·K

Product Details:
Place of Origin: CHINA
Brand Name: HUITIAN
Certification: SGS
Model Number: 0113
Detail Information
Place of Origin:
CHINA
Brand Name:
HUITIAN
Certification:
SGS
Model Number:
0113
Physical Form:
Paste
Color:
White
Main Component:
Polysiloxane
Density:
2.9g/cm³
Volatility(200℃,24h):
0.2%
Working Temperature:
-50~200℃
Thermal Conductivity:
2.1W/(m•K)
High Light:
high performance thermal compound , silicone thermal grease
Trading Information
Minimum Order Quantity:
50kg
Price:
Negotiation
Packaging Details:
2kg/bucket
Delivery Time:
5-8 days
Payment Terms:
L/C, T/T
Supply Ability:
1000kg/Month
Product Description

0113 TDS-EN.pdf

0113 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.

 

Product Features:

One-component, white;
Physical form: paste;
Wide working temperature range;
Nontoxic, non-corrosive to PCB and metal;
Eco-friendly, odorless;
Maintain dry and flowing at high temperature;
High performance on insulation, corona resistance, electric leakage resistance, and chemical resistance;
Can be manually glued or machine glued;
Thermal conductivity: 2.1W/m·K

 

Main Applications:

Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.

To fill the gap between high-power audion, thyristors and basic materials such as copper and aluminum reduce the temperature of electronic components.

 

 

Item Unit Typical Value
Item No.   0113
Physical Form   paste
Color   white
Main Component   polysiloxane
Density g/cm3 2.9
Penetration Degree 1/10cm 280
Volatility(200℃,24h) % 0.2
Volume Resistivity Ω*cm 1.0×1015
Dielectric Strength KV/mm 24
Breakdown Voltage KV/mm 20
Surface Resistance Ω 2.4×1014
0.1mm Thermal Resistance m2K/W 0.00011
Work Temperature -50~200
Heat Conductivity Coefficient W/(m·K) 2.1

 

Packing:

2kg/bucket, 6bukets/carton

 

Storage:

Store it in dry and cool places at the temperature of 0~35℃

Shelf life is 12 months

 

0113 Thermal Conductive Grease Gap Filler For CPU And Led Chip Nontoxic, non-corrosive to PCB and metal 2.1W/m·K 0

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