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6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound
Product Details:
| Place of Origin: | China |
| Brand Name: | Huitian |
| Model Number: | 6202 |
Payment & Shipping Terms:
| Minimum Order Quantity: | 10 SET |
|---|---|
| Price: | Negotiation |
| Packaging Details: | 41kg/Set A component 32kg/bucket. B component 9kg/bucket |
| Delivery Time: | 8-15 DAYS |
| Payment Terms: | L/C, T/T |
| Supply Ability: | 3000 KG MONTH |
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Detail Information |
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| Color: | B Yellow | Density G/cm3: | B 1.15 |
|---|---|---|---|
| Viscosity Mpa.s: | B 60 | Weight Ratio: | A:B =100:28 |
| Volume Ratio: | A:B =100:44 | Operation Time 130g GB/T 7123.1-2002）: | ≥75 |
| Highlight: | potting electronic components,potting compound for electronic components |
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Product Description
6202 (HT6202T) double component heat curing epoxy potting adhesive is for Automobile ignition coil potting
202 (HT6202T) double component heat curing epoxy potting adhesive is two components, heating curing, translucent, automobile ignition coil epoxy adhesive. Low viscosity, easy penetration of defoaming, permeability is good, cracking resistance is good , insulating property good, high temperature resistant.
Typical Applications
Automobile ignition coil potting
Characteristic before curing
Representative value range
A component
Color Grey
Density g/cm3(25℃) 1.85 1.82～1.88
(GB/T13354-1992)
Viscosity mpa.s(25℃)400000 300000～500000
GB/T 2794-1995
B component
Color Yellow
Density g/cm3(25℃) 1.15 1.10～1.20
(GB/T13354-1992)
Viscosity mpa.s(40℃) 60 40～70
(GB/T 2794-1995)
Characteristic after mixing
Color Grey
Weight ratio A:B =100:28
Volume ratio A:B =100:44
Operation time 130g GB/T 7123.1-2002) ≥75
Condition of cure min(90℃,130g) 90℃@3h+130℃@3h
Characteristic after curing
Harness: Shore-D(GB/T 531-1999) 92
Glass-transition temperature℃ 142
GB/T 11998-1989
Volume Resistivity Ω·cm(25℃) 1.0×1015
GB/T1692-1992
Dielectric Strength KV/mm(25℃)(GB/T1692-1992) ≥25
Bending strength: Mpa 105
shock strength KJ/m2,(GB/T 1843-2008) 2.7
Shear strength Mpa(GB/T13930)≥7
Dielectric constant(25℃,1.2MHz,GB/T1692-1992)3.8
dielectric dissipation factor(25℃,1.2MHz) 0.012
GB/T1692-1992
Thermal conductivity W/m.K(25℃)(GB/T 11025-1989) 0.6
water absorption %(ISO 62) ＜0.1
Work Temperature℃ -40～150
Direction for use
1. 1 glue injection: 90 ~ 100 ℃ preheated A component 2～3 hour(make sure adhesive hot enough, viscosity is low),Stir evenly inhaled or into the vacuum tank with agitator (Semi automatic filling and sealing potting process must first accurate weighing A component and then poured into tank). 80 ~ 90 ℃ while stirring vacuum for 2 to 3 hours(to no bubbles),keep warm and waiting to use.
A. semi automatic filling and sealing process: accurate weighing in component B, A:B =100:28,poured into which vacuum tank loaded accurately weighing A components,60 ~ 65 ℃ while stirring vacuum for 30 minutes,until no bubbles. Potting process begin, after potting Put in the oven to curing.
B. Automatic filling and sealing process:poured B component into which vacuum tank loaded accurately weighing A components, 35 ~ 45 ℃ while stirring vacuum for 30 minutes. Then adjust the A component and the B component of the discharge ratio(Weight ratio A:B =100:28；Volume ratio A:B =100:44),after ratio adjust, start inject adhesive,keep the temperature 60～65℃.After adhesive injection, put in the oven to curing.
2.Curing:put in 90℃ oven 3 hours, and slowly warming up to 130℃(warming up time keep in 30～40 minutes),curing in 130℃ 2.5～3 hours,after curing slowly cooling to 50℃, and take it out of oven(cooling time keep in 60 minutes).
Attention
Every time mix adhesive need keep in 5-10KGS,mixed adhesive should finish used in 1 hour. The Vacuum degree of vacuum tank and vacuum room should as low as possible.
Packing
41kg/Set
A component 32kg/bucket. B component 9kg/bucket
Storage
Store it in dry and shady places at the temperature of 8~28℃.Storage life 12 months
