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Shanghai Huitian New Material Co., Ltd
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0111 Silicone Thermal Conductive Grease Gap Filler For CPU or LED Chip Thermal conductivity 1.2W/m·K

0111 Silicone Thermal Conductive Grease Gap Filler For CPU or LED Chip Thermal conductivity 1.2W/m·K

0111 Silicone Thermal Conductive Grease Gap Filler For CPU or LED Chip Thermal conductivity 1.2W/m·K

Product Details:
Place of Origin: China
Brand Name: HUITIAN
Certification: SGS
Model Number: 0111
Detail Information
Place of Origin:
China
Brand Name:
HUITIAN
Certification:
SGS
Model Number:
0111
Physical Form:
Paste
Color:
White
Main Component:
Polysiloxane
Density:
2.5g/cm³
Volatility(200℃,24h):
0.2
Thermal Conductivity:
1.2 W/(m•K)
Working Temperature:
-50~200 ℃
High Light:
thermal paste compound , silicone thermal grease
Trading Information
Minimum Order Quantity:
200kg
Price:
Negotiation
Packaging Details:
1kg/bucket
Delivery Time:
5-8 days
Payment Terms:
T/T, L/C
Supply Ability:
5000kg/Month
Product Description

0111 TDS-EN.pdf

0111 is a one-component Silicone Thermal Conductive Grease suitable for gap filler and reducing the temperature of electronic components.

 

Product Features:

One-component, white;
Wideworkingtemperaturerange;
Nontoxic,non-corrosive to PCB and metal;
Eco-friendly, odorless;
Maintain dry and flowing at high temperature;
High performance on insulation, corona resistance, electric leakage resistance, and chemical resistance;
Can be manually glued or machine glued;
Thermal conductivity:1.2W/m·K
 
Item Unit Typical Value
Item No.   0111
Physical Form   paste
Color   white
Main Component   polysiloxane
Density g/cm3 2.5
Penetration Degree 1/10cm 330
Volatility(200℃,24h) % 0.2
Volume Resistivity Ω*cm 1.0×1015
Dielectric Strength KV/mm 24
Breakdown Voltage KV/mm 20
Surface Resistance Ω 2.5×1014
0.1mm Thermal Resistance m2K/W 0.00015
Work Temperature -50~200
Heat Conductivity Coefficient W/(m·K) 1.2

 

 

Main Applications:

Widely used for the thermal conductivity of electronic components including the filling of gap between CPU and heat sink.

For the filling of the gap between high-power audion, thyristors, and basic materials such as copper and aluminum to reduce the temperature of electronic components.

 

Packing:

1kg/bucket, 12bukets/carton

 

Storage:

Store it in dry and cool places at the temperature of 0~35℃

Shelf life is 12 months

 

0111 Silicone Thermal Conductive Grease Gap Filler For CPU or LED Chip Thermal conductivity 1.2W/m·K 0

 

 

 


 

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